Method for breaking conducting path formed on or in printed- circuit board and laser system for using the method

摘要

This invention provides a method for breaking a conducting path formed on or in a printed-circuit board. The method comprises steps of arranging a laser source and the printed-circuit board, irradiating a laser beam from the laser source onto a conductive inner wall portion of a through hole in the printed-circuit board so as to remove the conductive inner wall portion of the through hole from the printed- circuit board, and irradiating the laser beam onto a conductive contacting portion where a wiring pattern contacts with a land so as to remove the contacting portion from the printed-circuit board. This invention also relates to a laser system using the method and a printed- circuit board modified by the method.