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P-I-N TYPE PHOTODETECTOR, PHOTOELECTRIC CONVERSION CIRCUIT AND PHOTOELECTRIC CONVERSION MODULE

机译:P-I-N型光电检测器,光电转换电路和光电转换模块

摘要

PROBLEM TO BE SOLVED: To inhibit a dark current by reducing a leakage current, and to improve element characteristics by forming a fourth semiconductor layer, into which impurities are not doped intentionally, to a second semiconductor material having band gap energy larger than a first semiconductor material. ;SOLUTION: First or third semiconductor layers 30, 31, and 32 are laminated successively on a semiconductor substrate 20. The second and third semiconductor layers 31, 32 are formed in a mesa shape respectively. A first electrode layer 60 is formed on the top face of a second mesa section in an ohmic contact manner to the semiconductor layer 30. A second electrode layer 61 is shaped on the top face of a first mesa section in the ohmic contact manner to the semiconductor layer 32. A fourth semiconductor layer 40 is formed around the first or third semiconductor layers 30, 31, and 32. The fourth semiconductor layer 40 is constituted to a second semiconductor material having band gap energy larger than a first semiconductor material without intentionally doping impurities.;COPYRIGHT: (C)1997,JPO
机译:要解决的问题:通过减小带隙能量大于第一半导体的第二半导体材料,通过减小泄漏电流来抑制暗电流,并通过形成第四半导体层来改善元件特性,该第四半导体层中没有故意掺杂杂质。材料。 ;解决方案:第一或第三半导体层30、31和32依次层叠在半导体衬底20上。第二和第三半导体层31、32分别形成为台面形状。第一电极层60以与半导体层30的欧姆接触的方式形成在第二台面部分的顶面上。第二电极层61以与半导体层30的欧姆接触的方式在第一台面部分的顶面上成形。半导体层32。在第一或第三半导体层30、31和32周围形成第四半导体层40。第四半导体层40由带隙能量大于第一半导体材料的第二半导体材料构成,而没有故意掺杂杂质;版权:(C)1997,日本特许厅

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