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UNSATURATED POLYESTER RESIN COMPOSITION, CAST-MOLDING MATERIAL AND RTM MOLDING METHOD

机译:非饱和聚酯树脂组成,铸造材料和RTM成型方法

摘要

PROBLEM TO BE SOLVED: To obtain the subject composition capable of keeping high storage stability of a thixotropic agent even by compounding a filler, free from precipitation of filler and having good cast moldability by using a hydrophilic silica thixotropic agent and a hydrophobic silica thixotropic agent as essential components and adjusting the thixotropic index to a specific level. ;SOLUTION: The objective composition is composed of (A) an unsaturated polyester, (B) a polymerizable monomer (preferably styrene), (C) a thixotropic agent composed of hydrophilic fine silica powder (preferably fine silica powder having a specific surface area of 80-150m2/g and containing ≥1.8 silanol groups per 1nm2), (D) a thixotropic agent composed of hydrophobic fine silica powder (preferably fine silica powder having a specific surface area of 80-150m2/g and containing 1.8 silanol groups per 1nm2) and (E) a filler (preferably calcium carbonate, etc., having a particle diameter of 0.8-10μm). The TI(thixotropic index) of the composition composed of the components A to D is adjusted to ≤2. The sum of the components C and D is preferably ≤1.5 pts.wt. based on 100 pts.wt. of the sum of the components A and B. The weight ratio of C:D is preferably 20:80 to 80:20.;COPYRIGHT: (C)1997,JPO
机译:解决问题的方法:通过使用亲水性二氧化硅触变剂和疏水性二氧化硅触变剂,即使通过配合填料也能够获得保持触变剂的高储存稳定性,无填料沉淀并且具有良好的铸塑性的主题组合物。必要成分并将触变指数调整到特定水平。 ;解决方案:目标组合物由(A)不饱和聚酯,(B)可聚合单体(最好是苯乙烯),(C)由亲水性二氧化硅细粉(优选比表面积为2的细二氧化硅粉)组成的触变剂组成。 80-150m 2 / g且每1nm 2 包含≥1.8硅烷醇基),(D)由疏水性二氧化硅细粉(优选具有比表面积为80-150m 2 / g,每1nm 2 含<1.8硅烷醇基)和(E)填充剂(最好是碳酸钙等),粒径为0.8-10μm)。将由组分A至D组成的组合物的TI(触变指数)调节至≤2。组分C和D的总和优选≤1.5pts.wt。基于100pts.wt。 C∶D的重量比优选为20∶80至80∶20 。;版权:(C)1997,日本特许厅

著录项

  • 公开/公告号JPH0920858A

    专利类型

  • 公开/公告日1997-01-21

    原文格式PDF

  • 申请/专利权人 DAINIPPON INK & CHEM INC;

    申请/专利号JP19950172053

  • 发明设计人 SAITO TADAO;TOMIOKA KAN;YAMAZAKI TAKESHI;

    申请日1995-07-07

  • 分类号C08L67/06;B29C39/00;C08F283/01;C08K3/36;

  • 国家 JP

  • 入库时间 2022-08-22 03:35:35

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