METHOD OF PERFORMING ANTICORROSION TREATMENT OF SEMICONDUCTOR WAFER AND APPARATUS FOR PERFORMING ANTICORROSION OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To suppress the rate of occurrence of after corrosion using a simple device. ;SOLUTION: After RIE is performed in an etching chamber 54, a semiconductor wafer 2 is released in the atmosphere and carried into a cleaning chamber 12 of an alkali cleaner 10 and alkali cleaning process is processed. A valve WVX of an alkali line pipe 22 is opened and an alkali solution is fed onto an aluminum wire face of the semiconductor wafer 2 from a nozzle 22a. The semiconductor wafer 2 is left as it is for a specific period after feeding is stopped. Next, water cleaning is performed. A valve WV5 of an upper cleaning water pipe 24 is opened and cleaning water is fed onto the aluminum wire face of the semiconductor wafer 2 from a nozzle 24a. A spinner 18 starts rotating. For this reason, the semiconductor wafer 2 rotates while being cleaned with water. After completion of water cleaning, the spinner 18 continues to rotate for a specific period to perform shake-off processing of the cleaning water. The stand-by can be reduced by the bypass line 11 of a smaller pipe than the diameter of a pipe of a liquid nitrogen supply line 3.;COPYRIGHT: (C)1997,JPO