METHOD AND APPARATUS FOR DETECTING SURFACE ROUGHNESS IN PROCESS FOR ADJUSTING CHEMICAL MECHANICAL POLISHING PAD

摘要

PROBLEM TO BE SOLVED: To detect surface roughness accurately in the process for adjusting a chemical mechanical polishing pad. ;SOLUTION: The method and apparatus for determining the roughness of polishing face of a chemical mechanical polishing(CMP) pad 30 comprises a light source and associated optical system 32 for generating a light beam impinging on the polishing face of polishing pad 30, and a photodetector for detecting the light emitted from the polishing face upon impinging a light beam 34. The photodetector includes an element outputting a signal indicative of a detected light. The apparatus further comprises a unit for comparing an output signal from the photodetector with a prescribed signal corresponding thereto.;COPYRIGHT: (C)1997,JPO