Primer composition for bonding epoxy resin molding materials for semiconductor encapsulation

摘要

PURPOSE:To provide a primer composition excellent in adhesion to metals and plastic materials, curing characteristics, heat resistance of its cured films and water resistance by mixing a specific polyimide compound with a silane coupling agent. CONSTITUTION:A polyimide compound which has a structural unit of formula I (wherein R is a group of formula II or III; R1 is a divalent organic group; R2 and R3 are each a substituted or unsubstituted monovalent hydrocarbon group; Y is an oxygen atom or a divalent hydrocarbon group; n is 1-1,000; Z is a divalent organic group with an aromatic ring; X is a tetravalent organic group of formula IV, V or VI; and n is 1 or more) is mixed with a silane coupling agent (e.g. vinyltrimethoxysilane) of formula VII (wherein R4 is an organic group having an amino, mercapto or glycidyl group; R5 is a substituted or unsubstituted 1-6 C monovalent hydrocarbon group; M is a hydrolyzable atom or group; and a is 0, 1 or 2) to prepare a primer composition.