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Board thickness presumption manner and the device and the board thickness control unit null in board thickness controlling

机译:板厚推定方式以及装置和板厚控制单元在板厚控制中无效

摘要

PURPOSE:To control a plate thickness with high accuracy in consideration of an expansion of a gage-meter type roll in a plate thickness control. CONSTITUTION:A rolling load P, a draft position S, a bender load Pb are detected, further, the plate thickness (h) and a temperature a rolled stock 1 are measured on the outlet side of a mill 20. The expansion DELTAu of the roll is calculated by a roll expansion estimating part 11 through a measured temperature 20, each detected measured data are sent to a parameter estimating part 13 through a data tracking part 12 and each parameter (mill constant, bender mill constant, rolling offset, roll expansion) in an estimating expression of the plate thickness directly below the rolled roll is identified by a statical technique. The plate thickness (h) is recalculated by these identified parameters in an arithmetic part for the plate thickness and this estimated value (h) for the plate thickness is fed back to control the plate thickness.
机译:目的:在板厚控制中考虑到量规式辊的扩展,以高精度控制板厚。组成:检测轧制载荷P,牵伸位置S,弯曲机载荷Pb,此外,在轧机20的出口侧测量板厚(h)和轧制坯料1的温度。由轧辊膨胀估计部分11通过测量温度20计算轧辊,每个检测到的测量数据通过数据跟踪部分12发送到参数估计部分13,并且每个参数(轧机常数,折弯机轧机常数,轧制偏移,轧辊膨胀) )的估算表达式中,通过静态技术确定轧制辊正下方的板厚。通过这些识别出的参数在板厚的算术部分中重新计算板厚(h),并将该板厚估计值(h)反馈给控制板厚。

著录项

  • 公开/公告号JP2605540B2

    专利类型

  • 公开/公告日1997-04-30

    原文格式PDF

  • 申请/专利权人 日本鋼管株式会社;

    申请/专利号JP19920019894

  • 发明设计人 関根 宏;林 美孝;

    申请日1992-02-05

  • 分类号B21B37/18;

  • 国家 JP

  • 入库时间 2022-08-22 03:28:58

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