Resin seal formation manner of the semiconductor device and die device for that formation and is used for its manner ri - dohure - mu

摘要

PURPOSE:To prevent a resin burr from adhering to both faces of molds and to the surface of lead frames by a method wherein a pot and a passage for transfer use are arranged inside the lead frames and a molten resin material is injected and filled into a cavity. CONSTITUTION:A metal mold apparatus A is equipped with the following: an upper mold 11 on the fixed side; a lower mold 12 on the movable side; two or more required number of pots 13 which are arranged at the upper mold 11 and are used to supply a resin material; a plunger 14 for pressurizing the resin material; the required number of cavities 15 which are formed on P.L parting line faces at both molds; a passage 16 for transfer use of the molten resin material interlinking the individual pots 13 and the required cavities 15; groove parts 17 for mounting lead frames on a P.L face of the lower mold 12. The individual pots 13 and the passage 16 for transfer use are constituted in such a way that they are arranged at the inside of the lead frames 19, 19a, 19b when the lead frames are mounted on the groove parts 17. By this setup, even when one part of the molten resin material which has been pressurized and transferred flows out to the outside of the passage 16 for transfer use, the material is blocked by an insertion-mounting part 192; it is possible to prevent a resin burr from adhering to faces of both molds and to the surface of the lead frames due to the penetration of the material into the P.L face.