Additional strength manner and additional strength device and additional strength component null of rim section of semiconductor

摘要

PURPOSE: To fit a reinforcing member to every semiconductor wafer 1 precisely and efficiently for effectively avoiding the damage, etc., to the outer periphery of extremely thinned semiconductor wafer. ;CONSTITUTION: In order to avoid the damage, etc., to the outer periphery of semiconductor wafers W when the semiconductor wafers W having impurity diffused layers on both surfaces and an impurity non-diffused layer in the central part of the thickness width are sliced up into two sections by an inner peripheral slicer, reinforcing members P separately formed near the slicing ends of the outer periphery of the semiconductor wafers W are bond-fixed using a bonding agent. Next, one each of reinforcing member P coated with the bonding agent comprising a synthetic resin material in an arc length exceeding half of the outer periphery of the semiconductor wafers W formed in the same or slightly smaller diameter than that of the wafers W is brought into the diameter expanded state to be engaged with one each of the semiconductor wafer W and then the expanded state of the reinforcing member is to be released.;COPYRIGHT: (C)1993,JPO&Japio