FILMS AN DMOULDING COMPOUNDS BONDABLE AFTER SWELLING WITH THEIR GROUNDMASS NOT CONTAINING PVC (POLYVINYL CHLORIDE)

摘要

The present invention relates to a moulding compound containing a polymer composed of the monomer ethylene and at least one co-monomer selected from the group consisting of vinyl esters of a C2 to C3 alkane carboxylic acid and C1 to C4 alkyl esters of acrylic acid, in which the proportion of co-monomer is at least 27 wt.%. The moulding compound also contains a polyolefine or a mixture of several polyolefines in a proportion of at least 10 wt.%. of the moulding compound. The THF extract to DIN 53738 with an extraction time of 4 h is greater than 35 %. The moulding compound is used to produce solvent-bonding foils and sealing webs, especially by calendering.