首页> 外国专利> METHOD FOR CONNECTING A MICROCIRCUIT TO THE INDUCTIVE COUPLING COIL OF A SMART CARD AND ASSEMBLY FOR AN INDUCTIVELY COUPLED SMART CARD

METHOD FOR CONNECTING A MICROCIRCUIT TO THE INDUCTIVE COUPLING COIL OF A SMART CARD AND ASSEMBLY FOR AN INDUCTIVELY COUPLED SMART CARD

机译:用于将微电路连接到智能卡的感应耦合线圈以及用于电感耦合的智能卡的组件的方法

摘要

The present invention relates to the smart cards inductively of a kind of smart card of connection microcircuit (2) to inductance-coupled coil (1,11) and component. The method according to the invention, in fabrication stage (1) coil, the coil combines recess/slot structure (15,13) of opening supplemented with socket (3), on the coil (1,11) of the end (4,7) of these socket conductors, on socket to pass them through open depression/slot device (13,15), which is incorporated by its contact area (5) to partial threads shape conducting wire (4, (150 recess/slot device (151, (152 by opening.
机译:本发明涉及一种将微电路(2)连接到电感耦合线圈(1,11)和部件的智能卡的感应式智能卡。根据本发明的方法,在制造阶段(1)的线圈中,该线圈在端部(4)的线圈(1,11)上结合开口的凹口/槽结构(15,13)并增加插座(3),这些插座导体中的7)在插座上穿过开放的凹陷/槽装置(13,15),并通过其接触区域(5)结合到局部螺纹形状的导线(4,(150凹陷/槽装置( 151,(152通过打开。

著录项

  • 公开/公告号EP0746826A1

    专利类型

  • 公开/公告日1996-12-11

    原文格式PDF

  • 申请/专利权人 PICOPAK OY;

    申请/专利号EP19930907879

  • 发明设计人 AINTILA AHTI;

    申请日1993-04-01

  • 分类号G06K19/07;

  • 国家 EP

  • 入库时间 2022-08-22 03:21:03

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