Methods for making an optical fiber array used in an optical fiber array/optical integrated circuit interconnection assembly

摘要

The invention includes four preferred methods for making an optical fiber array for coupling to an optical integrated circuit (OIC) assembly of a related invention. The methods include steps of selecting first and second materials which have substantially similar thermal coefficients of expansion to form first and second parts, respectively. The first and second parts are formed by polishing, grinding or cutting respective larger material pieces to an appropriate size, or by molding the first and second parts from the materials. An adhesive is applied to one of the first and second parts, and optical fibers are positioned in proximity to one of the first and second parts. The first and second parts are joined so that the adhesive contacts the optical fibers between the first and second parts. The adhesive is then cured by the application of heat with an appropriate temperature or by irradiating the adhesive with ultraviolet light, depending upon the type of adhesive used. The resulting optical fiber array protects the stripped end portions of the optical fibers which are relatively fragile. Also, because the first and second parts are formed from materials with substantially similar thermal coefficients of expansion, the optical fiber array made by the methods of this invention is less subject to breakage or loss in bonding strength of the adhesive caused the application of temperatures and/or humidity conditions which are different from those under which the optical fiber array was assembled. Thus, the alignment and spacing of the optical fibers in the optical fiber array can be maintained to effectively align the ends of the optical fibers with the ends of optical waveguides when the optical fiber array is joined and adhered to the OIC assembly.