Wafer Chuck for Spherical Aberration Correction of Stepper

摘要

This study is concerned with several times of modification of the spherical surface of the staff member (stepper),In order to reduce the phase transformation of the wafer (16) with several spherical surface modifications, the spherical surface of the lens (14) is reduced several times, so as to minimize the distortion of the phase surface and form a higher specified curvature than the central part. There are benefits of reduction,This can be combined with the die by die tigt with weight-loss function. The chip can ensure fair profit.