首页> 外国专利> Fabrication method for integrated structure such as photoconductive impedance-matched infrared detector with heterojunction blocking contacts

Fabrication method for integrated structure such as photoconductive impedance-matched infrared detector with heterojunction blocking contacts

机译:具有异质结阻挡触点的光导阻抗匹配红外探测器等集成结构的制作方法

摘要

A photoconductive isotype heterojunction impedance-matched infrared detector has blocking contacts which are positioned on the bottom side of the detector. The blocking contacts prevent transfer of minority carriers from the active region of the detector, thereby extending the lifetime of these carriers. The detector is formed by first fabricating an active layer followed by an isotype blocking layer on a growth substrate. These layers are etched and appropriate passivation layers and contacts are applied. A mechanical supporting substrate is applied to the detector and the growth substrate is removed. Etch stop holes are formed which extend into the active layer of the detector. A precision thickness of the active layer required in an impedance-matched detector design is produced by thinning the active layer in an etching process until the surface of the active layer reaches the etch stop hole. The detector produced in accordance with the structure and methods set forth herein is highly suitable for use in an array of such detectors which can form an infrared focal plane array.
机译:光电导同型异质结阻抗匹配的红外探测器具有阻挡触点,该阻挡触点位于探测器的底侧。阻挡触点防止少数载流子从检测器的有效区域转移,从而延长了这些载流子的寿命。通过首先在生长衬底上制造有源层,然后制造同型阻挡层来形成检测器。蚀刻这些层并施加适当的钝化层和接触。将机械支撑衬底施加到检测器,并去除生长衬底。形成蚀刻停止孔,其延伸到检测器的活性层中。阻抗匹配检测器设计中所需的有源层的精确厚度是通过在蚀刻过程中使有源层变薄直到有源层的表面到达蚀刻停止孔来产生的。根据本文阐述的结构和方法生产的检测器非常适合用于可以形成红外焦平面阵列的这种检测器的阵列中。

著录项

  • 公开/公告号US5580795A

    专利类型

  • 公开/公告日1996-12-03

    原文格式PDF

  • 申请/专利权人 LORAL VOUGHT SYSTEMS CORPORATION;

    申请/专利号US19950389549

  • 发明设计人 THOMAS R. SCHIMERT;SCOTT L. BARNES;

    申请日1995-02-15

  • 分类号H01L31/18;H01L25/00;H01L31/00;

  • 国家 US

  • 入库时间 2022-08-22 03:11:03

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