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Method of and device for in situ real time quantification of the morphology and thickness of a localized area of a surface layer of a thin layer structure during treatment of the latter

机译:在薄层结构的表面处理过程中对薄层结构的表层的局部区域的形态和厚度进行原位实时定量的方法和装置

摘要

A method for in situ quantification of the morphology and the thickness of a localized area of a surface layer of a thin layer structure entails directing a beam of white light and one or two lazer beams onto a sample enclosed in a vacuum treatment chamber, using a monochromator for a spectral analysis of the white light reflected by the sample and/or differential interferometry with a predetermined wavelength to determine the thickness and the instantaneous rate of variation of the thickness of the surface layer of the sample and to display a monochromatic map of the morphology of the localized area obtained by differential interferometry using a matrix camera. One application is controlling vacuum treatment of thin layer structures, especially semiconductors and integrated circuits, monitoring the morphology, thickness and rate of variation of thickness of the surface layer of the treated sample in situ and in real time.
机译:薄层结构表面层的形貌和局部区域厚度的原位量化方法是将白光束和一个或两个激光束对准使用真空处理室封闭的样品。单色仪,用于对样品反射的白光进行光谱分析和/或使用预定波长的差分干涉法确定样品表面层的厚度和瞬时变化率,并显示样品的单色图。通过使用矩阵相机的差分干涉法获得的局部区域的形态。一种应用是控制薄层结构(尤其是半导体和集成电路)的真空处理,现场并实时监控被处理样品表面层的形态,厚度和厚度变化率。

著录项

  • 公开/公告号US5648849A

    专利类型

  • 公开/公告日1997-07-15

    原文格式PDF

  • 申请/专利权人 SOFIE;

    申请/专利号US19950418137

  • 发明设计人 JEAN CANTELOUP;JACKY MATHIAS;

    申请日1995-04-05

  • 分类号G01B9/02;

  • 国家 US

  • 入库时间 2022-08-22 03:09:44

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