首页> 外国专利> POLYETHYLENE RESIN COMPOSITION FOR EXTRUSION LAMINATION AND EXTRUSION LAMINATE PRODUCED THEREFROM

POLYETHYLENE RESIN COMPOSITION FOR EXTRUSION LAMINATION AND EXTRUSION LAMINATE PRODUCED THEREFROM

机译:用于挤出层压的聚乙烯树脂组合物和由此生产的挤出层压制品

摘要

PROBLEM TO BE SOLVED: To obtain a polyethylene resin compsn. for extrusion lamination which has not only low-temp. heat sealability, a high heat seal strength, and excellent hot tack properties but also an excellent processibility and a good slipperiness by compounding a linear low-density polyethylene and two low-density polyethylenes. ;SOLUTION: This compsn. comprises 50-99wt.% linear low-density ethylene copolymer (A) having a density of 0.86-0.94 and a melt flow rate(MFR) of 0.1-40 and obtd. by copolymerizing 80-99.5mol% ethylene and 20-0.5mol% 3-20C α-olefin in the presence of a metallocene compd. as the catalyst and 50-1wt.% low- density polyethylenes comprising low-density polyethylene (B) having a density of 0.91-0.93, an MFR of 0.1-10, and a melt tension of 4g or higher and low- density polyethylene (C) having a density of 0.91-0.93, an MFR of 1-30, and a melt tension lower than 4g in a wt. ratio of B/C of (100/0)-(1/99).;COPYRIGHT: (C)1998,JPO
机译:要解决的问题:获得聚乙烯树脂组合物。用于不仅具有低温的挤出层压。通过混合线性低密度聚乙烯和两种低密度聚乙烯,可实现高热封性,高热封强度和优异的热粘性,同时还具有出色的可加工性和良好的滑爽性。 ;解决方案:此组件。包含50-99wt。%的线性低密度乙烯共聚物(A),其密度为0.86-0.94,熔体流动速率(MFR)为0.1-40,且为obtd。通过在茂金属的存在下使80-99.5mol%的乙烯和20-0.5mol%的3-20Cα-烯烃共聚。作为催化剂和50-1wt。%的低密度聚乙烯,包括密度为0.91-0.93,MFR为0.1-10,熔体张力为4g或更高的低密度聚乙烯(B)和低密度聚乙烯( C)的密度为0.91-0.93,MFR为1-30,并且熔体张力低于4g。 B / C的比率为(100/0)-(1/99).;版权:(C)1998,JPO

著录项

  • 公开/公告号JPH10120841A

    专利类型

  • 公开/公告日1998-05-12

    原文格式PDF

  • 申请/专利权人 ASAHI CHEM IND CO LTD;

    申请/专利号JP19960276379

  • 申请日1996-10-18

  • 分类号C08L23/08;B29C47/02;B32B27/32;C08L23/04;C08L23/16;C08L23/18;

  • 国家 JP

  • 入库时间 2022-08-22 03:08:48

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