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The temperature control equipment of operational target ones which are heated electrically, and operational target ones which are heated electrically

机译:电加热对象物和电加热对象物的温度控制设备

摘要

(57) Abstract The rotary possible drum which is heated electrically (10) it seems the way and the temperature control equipment in order to control the temperature of target ones of operational it is heated electrically. The cylindrical shape drum (10) and also revolution it is installed possibly, the electric heater (36, 38 and 40) the temperature control mechanism which is jointed electrically controls temperature by adjusting the electric heater (36, 38 and 40) to electric current according to the control signal. The cylindrical shape drum (10) and also revolution it is installed possibly, the temperature sensor (42, 44 and 46) the temperature sensor which is jointed electrically (42, 44 and 46) feature, the cylindrical shape drum (10) checking the temperature of the surface, generates the temperature signal which displays that. The cylindrical shape drum (10) the microprocessor which is installed in rotary failure (68), temperature of the drum which is heated electrically by generating the control signal according to the temperature signal, is controlled. Temperature control means (48), the temperature sensor (42, 44 and 46) means, and the microprocessor (68) the optical feature which is concatenated to means (66), as the temperature signal, the temperature sensor which turns (42, 44 and 46) from means, the microprocessor which does not turn (68) is transmitted to means optically, the control signal is transmitted, the microprocessor which does not turn (68) from means, the temperature control means which turn (48) optically.
机译:(57)<摘要>似乎有可能对电加热的可旋转鼓进行加热(10)的方式和温度控制设备以控制其运行的目标温度。可以安装圆筒状的滚筒(10)并使其旋转,通过将电加热器(36、38和40)调整为电流,将电加热器(36、38和40)连接在一起的温度控制机构以电方式控制温度。根据控制信号。圆筒形滚筒(10)可能也旋转安装,温度传感器(42、44和46)电气连接(42、44和46)的温度传感器的特征是,圆筒形滚筒(10)检查表面的温度,生成显示该温度的温度信号。控制旋转故障(68)中安装的微处理器的圆筒形鼓(10),通过根据温度信号生成控制信号来电加热鼓的温度。温度控制装置(48),温度传感器(42、44和46)装置以及微处理器(68),将与装置(66)相连的光学特征作为温度信号,转动(42,如图44和46所示),不转动的微处理器(68)被光学地传送到装置,控制信号被传送,不转动的微处理器(68),光学地转动(48)的温度控制装置, 。

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