BONDING AGENT TRANSFER COATING DEVICE AND MANUFACTURE OF ELECTRONIC COMPONENT USING THE BONDING AGENT TRANSFER COATING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a bonding agent coating device, which is constituted so as to be able to mount a large-sized semiconductor device or the like and a multitude of semiconductor devices or the like simply and with good accuracy, by a method wherein a bonding agent is uniformly transferred by coating on the substrate, which is not necessarily constituted as a flat surface, of an electronic component. ;SOLUTION: This bonding agent coating device is constituted into a structure, wherein bonding agent coating members 41 are pressed on the major surface 10a of a substrate 10 via a head 36, the members 41 are respectively pressed on the main surface 10a of this substrate 10 with a specified pressing force by the elastic force of each elastic member 42 according to the states of the main surface 10a of the substrate 10 due to undulations, a distortion, roughnesses, a slope or the like to transfer by coating each bonding agent 11 fed to bonding agent coating parts 41a on the main surface 10a of this substrate 10.;COPYRIGHT: (C)1998,JPO