Vacuum adsorption pincette and its adsorption manner

摘要

PROBLEM TO BE SOLVED: To limit shifting of an angle for using the longitudinal direction of a vacuum pincette as a rotational axis at the time of insertion to a minimum by inserting suction parts between wafers, then expanding a space between these suction parts and sucking the wafers. ;SOLUTION: Two vacuum suction parts 11 are fixed and the suction surfaces thereof are disposed on the same plane. An arm 12 is moved by an arm opening/ closing mechanism section 13. A main body 18 is moved toward wafers and the vacuum suction parts 11 are inserted between the wafers. By such insertion, influence of shifting of an angle for using the longitudinal direction of the main body 18 as a rotational axis is prevented. Then, the arm 12 is opened to match each of the diameter of the wafer, and the wafer is sucked. Since the wafer is pulled in this state and transferred, even a wafer having a large diameter is stably transferred.;COPYRIGHT: (C)1998,JPO