PROBLEM TO BE SOLVED: To improve a bonding quality, when a bonding tool of a gang bonding apparatus is depressed, by correcting a tilt of a bonding contact surface with respect to a lower surface of the tool to make uniform a pressing force applied to the contact surface. ;SOLUTION: A semiconductor element 1 on a stage 2 is positioned by an XY θ stage 4 with respect to Cu leads 3 fixed to a clamper 10. A bonding tool 8 is lowered to push the Cu leads 3 against Al pads 12 on a semiconductor element 1, and then the leads and pads are subjected to an ultrasonic bonding process. At this time, the stage 2 is rocked by a rotary shaft 14 and another rotary shaft perpendicular thereto around a center of the semiconductor element 1 as a rotary center, whereby a tilt of the bonding surface can be passively corrected with respect to a lower surface of the bonding tool 8.;COPYRIGHT: (C)1997,JPO
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