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Two-color infrared simultaneous detector having a common intermediate layer metal contact

机译:具有公共中间层金属触点的双色红外同时检测器

摘要

An array of dual-band HgCdTe radiation detectors (10) wherein individual detectors (10) include a first layer (14) having a first type of electrical conductivity and a bandgap selected for absorbing radiation within a first spectral band (MWIR). The radiation detectors (10) also each include a second layer (16) overlying the first layer (14). The second layer (16) has a second type of electrical conductivity that is opposite the first type of electrical conductivity. Each radiation detector (10) further includes a third layer (18) overlying the second layer (16), the third layer (18) having the first type of electrical conductivity and a bandgap selected for absorbing radiation within a second spectral band (LWIR). The first and second spectral bands are selected from SWIR, MWIR, LWIR, and VLWIR. The first, second and third layers (14, 16, 18) are contained within at least one mesa structure (10a, 10b; 11) that supports on a top surface thereof a first electrical contact (24) to the first layer (14) and a second electrical contact (28) to the third layer (18). The at least one mesa structure (10a, 10b; 11) further supports on a sidewall region (10b'; 11b) thereof an electrical contact (30) to the second layer (16). The sidewall electrical contact (30) is coupled to an electrically conductive bus (32) that is conductively coupled in common to mesa structure sidewall electrical contacts (30) of the plurality of radiation detectors (10). As a result, each radiation detector site (10) is simplified in construction, and may be reduced in area over a site wherein a separate (third) contact, such as an indium bump, is required to contact the second layer (16). IMAGE
机译:双频带HgCdTe辐射探测器(10)的阵列,其中各个探测器(10)包括具有第一类型电导率的第一层(14)和选择用于吸收第一光谱带(MWIR)内辐射的带隙。放射线检测器(10)还各自包括覆盖在第一层(14)上的第二层(16)。第二层(16)具有与第一类型电导率相反的第二类型电导率。每个辐射检测器(10)还包括覆盖第二层(16)的第三层(18),第三层(18)具有第一类型的电导率和被选择用于吸收第二光谱带(LWIR)内的辐射的带隙。第一和第二光谱带选自SWIR,MWIR,LWIR和VLWIR。第一,第二和第三层(14、16、18)包含在至少一个台面结构(10a,10b; 11)内,该台面结构在其顶表面上支撑与第一层(14)的第一电触点(24)。第二电触点(28)与第三层(18)相连。至少一个台面结构(10a,10b; 11)还在其侧壁区域(10b′; 11b)上支撑与第二层(16)的电接触(30)。侧壁电触点(30)耦合到导电总线(32),该导电总线共同地耦合到多个辐射检测器(10)的台面结构侧壁电触点(30)。结果,简化了每个放射线检测器部位(10)的结构,并且在需要单独的(第三)接触例如铟凸块接触第二层(16)的部位上可以减小其面积。 <图像>

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