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The bamboo compilation flooring uses that the floor construction structure

机译:竹编地板用地板的结构构造

摘要

PROBLEM TO BE SOLVED: To provide a bamboo laminate which has an attractive appearance and a feel peculiar to bamboo, is free from warping, expansion shrinkage or cracking, and is humidity-and mildew-proof. SOLUTION: This bamboo laminate is composed of at least, two pieces of bamboo board 1 arranged horizontally, and another set of at least, two pieces of bamboo board 1 similarly arranged horizontally, which are laminated over the former in such a manner that the joint 2 between the adjacent bamboo boards 1 of the upper layer is deviated from that 2 between the adjacent bamboo boards 1 of the lower layer. In addition, the joints and the layer laminated parts 3 are glued together under pressure. Further, as an alternative preparing method, an aggregated board is formed by sticking at least, two pieces of horizontally arranged bamboo board together with an adhesive, and another laminate board is laminated over the laminate board in such a manner that the position of the joint of the upper layer is partially shifted from that of the lower layer. Finally this laminate is treated by a pressure adhesive method.
机译:要解决的问题:提供一种竹层压板,该竹层压板具有吸引人的外观和竹子特有的感觉,没有翘曲,膨胀收缩或开裂,并且防潮和防霉。解决方案:此竹层压板由至少两块水平布置的竹板1和另一组至少两块水平布置相似的竹板1组成,它们以如下方式叠合在前者上上层的相邻竹板1之间的图2与下层的相邻竹板1之间的图2偏离。另外,接头和层层叠部3在压力下粘接在一起。此外,作为替代的制备方法,通过将至少两块水平布置的竹板与粘合剂粘合在一起来形成骨料板,并且将另一块层压板层压在层压板上,使得接合位置上层的部分偏离下层的部分。最后,通过压力粘合方法对该层压板进行处理。

著录项

  • 公开/公告号JP2738520B2

    专利类型

  • 公开/公告日1998-04-08

    原文格式PDF

  • 申请/专利权人 MITSUBA KK;

    申请/专利号JP19950197090

  • 发明设计人 HASHIMOTO TAKASHI;

    申请日1995-07-10

  • 分类号B27J1/00;B27M3/00;B27M3/04;B32B9/02;B32B21/00;E04F15/04;E04F15/10;

  • 国家 JP

  • 入库时间 2022-08-22 02:59:12

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