首页> 外国专利> Polymethacrylate molding compound with increased heat resistance and increased thermal degradation stability

Polymethacrylate molding compound with increased heat resistance and increased thermal degradation stability

机译:具有增强的耐热性和增强的热降解稳定性的聚甲基丙烯酸酯模塑料

摘要

The invention relates to a polymerisation process for the preparation of polymethacrylate moulding compositions having a high heat deflection temperature (heat resistance) and high stability to thermal degradation, in which at least 70% by weight of the polymethacrylate moulding composition is prepared at a monomer concentration of at least 5 mol per litre of reaction mixture, which preferably contains the monomers, the polymer formed therefrom and further polymerization auxiliaries. The reaction is preferably carried out batchwise (discontinuously), for example in a stirred reactor operated in batch mode.
机译:本发明涉及制备具有高热变形温度(耐热性)和高的热降解稳定性的聚甲基丙烯酸酯模塑组合物的聚合方法,其中按单体浓度制备至少70重量%的聚甲基丙烯酸酯模塑组合物。每升至少含有5摩尔的反应混合物,优选含有单体,由其形成的聚合物和进一步的聚合助剂。该反应优选分批(不连续)进行,例如在以分批模式操作的搅拌反应器中进行。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号