HEAT-CURING SOLVENT-FREE ONE-COMPONENT ADHESIVES WHICH ARE BASED ON POLYURETHANES AND WHICH DO NOT GIVE OFF ELIMINATION PRODUCTS, A PROCESS FOR THEIR PREPARATION, AND THEIR USE

摘要

Disclosed is a heat-curing solvent-free one-packcomposition comprising A) as a hardener component, apolyaddition product containing hydroxyl and uretdione groups,B) as a binder component, a 1,2-epoxide compound having morethan one 1,2-epoxide group and one or more hydroxyl groupsin the molecule, C) a catalyst for polymerizing epoxidegroups, and D) optionally, a further hydroxyl-containingcompound. The composition is useful as a polyurethane (PU)adhesive which does not give off an elimination product.