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ELECTRODEPOSITED FOIL WITH CONTROLLED PROPERTIES FOR PRINTED CIRCUIT BOARD APPLICATIONS AND PROCEDURES AND ELECTROLYTE BATH SOLUTIONS FOR PREPARING THE SAME
ELECTRODEPOSITED FOIL WITH CONTROLLED PROPERTIES FOR PRINTED CIRCUIT BOARD APPLICATIONS AND PROCEDURES AND ELECTROLYTE BATH SOLUTIONS FOR PREPARING THE SAME
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机译:用于印刷电路板应用的具有可控特性的电沉积箔及其制备方法和电解质浴溶液
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摘要
a conductive copper foil (20) is used in the preparation of printed circuit boards is made by electrolysis from a solution (18) of electrolyte containing copper ions, sulfate ions, animal glue and thiourea.the thio urea has the effect of reducing the surface roughness of the sheet in order to allow a higher current density operation, and / or to modify the ductility of the leaf.
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