首页> 外国专利> ELECTRODEPOSITED FOIL WITH CONTROLLED PROPERTIES FOR PRINTED CIRCUIT BOARD APPLICATIONS AND PROCEDURES AND ELECTROLYTE BATH SOLUTIONS FOR PREPARING THE SAME

ELECTRODEPOSITED FOIL WITH CONTROLLED PROPERTIES FOR PRINTED CIRCUIT BOARD APPLICATIONS AND PROCEDURES AND ELECTROLYTE BATH SOLUTIONS FOR PREPARING THE SAME

机译:用于印刷电路板应用的具有可控特性的电沉积箔及其制备方法和电解质浴溶液

摘要

a conductive copper foil (20) is used in the preparation of printed circuit boards is made by electrolysis from a solution (18) of electrolyte containing copper ions, sulfate ions, animal glue and thiourea.the thio urea has the effect of reducing the surface roughness of the sheet in order to allow a higher current density operation, and / or to modify the ductility of the leaf.
机译:导电铜箔(20)用于制备印刷电路板,是通过电解由含有铜离子,硫酸根离子,动物胶和硫脲的电解质溶液(18)制成的。为了允许更高的电流密度操作和/或改变叶片的延展性,薄片的粗糙度。

著录项

  • 公开/公告号EP0443009B1

    专利类型

  • 公开/公告日1998-01-07

    原文格式PDF

  • 申请/专利权人 GOULD ELECTRONICS INC;

    申请/专利号EP19900913685

  • 发明设计人 DIFRANCO DINO F.;CLOUSER SIDNEY J.;

    申请日1990-09-12

  • 分类号C25D1/04;C25D3/38;C25C1/12;

  • 国家 EP

  • 入库时间 2022-08-22 02:50:44

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