A solid-state imaging device having a charge-coupled device having an incident surface that can be aligned with a focal plane

摘要

The solid-state imaging device includes a rigid holding portion 41 having a hollow space, an elastic plate member 42 in a hollow space, a charge coupled device integrated on the semiconductor chip 43 mounted on the elastic plate member, An optical lens 44 for condensing an image on the optoelectronic conversion area of the charge coupled device; an optical lens 44 for connecting the bottom surface of the holding part and the elastic plate member so as to deform between the elastic plate member and the semiconductor chip, To the focal plane.