Test pads and test pads for adhesion testing

摘要

In general, in a COG (Chip On Glass) method in which a semiconductor IC is directly mounted on a glass substrate of a liquid crystal display device, the output electrodes of the semiconductor IC and the pads on the glass substrate must have good electrical connection. However, in order for the electrical connection between the output electrode and the pad to be good, the adhesion between the output electrode and the pad bonded by an adhesive means such as anisotropic conductive film (ACF) must be sufficiently high . Therefore, when the output electrode and the pad are bonded by the bonding means, the adhesion region between the output electrode and the pad must be inspected. As a transparent electrode. However, since the transparent electrode has a high resistance, the electrical characteristics between the output electrode and the pad are poor.;The present invention includes a method of forming a dummy electrode separate from the output electrode in the semiconductor IC, or forming a dummy bump other than the bump formed on the output electrode. Therefore, when the semiconductor IC and the glass substrate are bonded to each other, the adhesion state between the dummy electrode and the glass substrate or between the dummy bump and the glass substrate is checked, A semiconductor IC having the dummy electrode, or a structure of a semiconductor IC having the dummy bump formed thereon.