HOT-WALL TYPE RAPID THERMAL PROCESSING DEVICE

摘要

Novel hot-walled RTP devices are disclosed. A reaction furnace having a solidified interior thereof, a first heater positioned at an upper end of an outer surface of the reactor for heating the high temperature part of the reactor, a lower end of the outer surface of the reactor and the lower temperature part for heating the low temperature part of the reactor; And a second heater positioned at a vertical lower end of the first heater, and a heat shield plate positioned between the first heater or the second heater and the reaction furnace and movable up and down. By preventing radiant heating from the top to the bottom, it is possible to reduce the length of the transition sheet and to eliminate thermal bundle differences between the wafer on top of the boat and the wafer on the bottom.