首页> 外国专利> the value of the oil production, the connection resistance between the ic and the performance of new processing technology for (free on rail ACHIEVING NOVEL PROCESSING TECHNIQUES PRODUCTION - WORTHY, LOW DIELECTRIC, LOW INTERCONNECT RESISTANCE and HIGH PERFORMANCE ic)

the value of the oil production, the connection resistance between the ic and the performance of new processing technology for (free on rail ACHIEVING NOVEL PROCESSING TECHNIQUES PRODUCTION - WORTHY, LOW DIELECTRIC, LOW INTERCONNECT RESISTANCE and HIGH PERFORMANCE ic)

机译:的产油价值,ic之间的连接电阻以及新加工技术的性能(免费在轨道上实现新型加工技术生产-值得,低介电,低互连电阻和高性能ic)

摘要

a metal line (14) in a semiconductor device with mutual connection part (18) of copper, gold, or platinum and a low resistance metal form and let be the benzo derivatives or with his constant with the medium (20); the uc7acuc9c8uc5d0 of separation. the three - layer of resistance structure (16) lift off process and the mutual connection part (18); the formation of very useful. the dielectric constant of material (20) has a low resistance metal (18) on the proliferation of the spread from the provide. the three - layer resistance (16) as the first layer of polymer material (16a), a hard mask material of the second layer (16b) and the resistance of the material layer (16c) etc.. the results of the structure increases the speed and made a integrated company easy to provide.
机译:半导体装置中的金属线(14),具有铜,金或铂的相互连接部分(18)和低电阻金属形式,并且是苯并衍生物或在介质(20)中具有常数。 uc7ac uc9c8 uc5d0分隔。三层电阻结构(16)剥离工艺和相互连接的部分(18);的形成非常有用。材料(20)的介电常数具有低电阻的金属(18)从扩散扩散提供。作为第一层聚合物材料(16a)的三层电阻(16),第二层(16b)的硬掩模材料和材料层(16c)的电阻等。结构的结果增加了速度,使整合后的公司易于提供。

著录项

  • 公开/公告号KR19980700690A

    专利类型

  • 公开/公告日1998-03-30

    原文格式PDF

  • 申请/专利权人 이시마루 미키오;

    申请/专利号KR19970704140

  • 发明设计人 청 로빈 더블유.;창 마크 에스.;

    申请日1997-06-19

  • 分类号H01L23/532;

  • 国家 KR

  • 入库时间 2022-08-22 02:45:26

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