Method of post mold curing plastic encapsulated semiconductor chips mounted on lead frames by operating a post mold curing apparatus in association with a molding line system

摘要

A post mold curing apparatus for use in association with a molding line system for providing plastic encapsulated semiconductor chips mounted on leadframes is disclosed which includes a leadframe carrier having a rotary, substantially cylindrical shaped assembly for containing and moving a plurality of semiconductor chips and their associated leadframe strips into both an elevated temperature post mold curing region and into a lower temperature cool-down region. Each of the leadframe strips with their associated semiconductor chips are sequentially inserted into cavity regions located in the cylindrical assembly to assist in moving each of the plurality of leadframe strips through the elevated temperature post mold curing region, and subsequently, each of the leadframe strips with their associated semiconductor chips are removed from the cavity regions after passing through the lower temperature cool-down region.