FAILURE ANALYSIS SYSTEM AND FAILURE ANALYZING METHOD FOR THIN FILM HEAD PRODUCT

摘要

PROBLEM TO BE SOLVED: To enhance yield while shortening countermeasure times by arranging to display inspection results of plural pieces of chips based on positions of wafers in a wafer unit to facilitate the analyzing of failure factors such as extending over plural processes. ;SOLUTION: Wafers 112, blocks 113 and thin film products 114 to be manufactured in a thin film forming process 109, a machining process 110 and an assembling process 11 are inspected by corresponding inspection instrument groups A to C 103 to 105. The inspection instrument group A103, the inspection instrument group B104 and the inspection instrument group C105 respectively transmit inspection results, wafer numbers and chip addresses being in the wafers and inspection results, wafer numbers, block numbers and chip addresses being in the blocks and inspection results, chip numbers, block numbers to which the chips belonging and wafer numbers to a quality database 102 as inspection data. Moreover, an analyzing terminal 101 mappingly displays inspection results belonging to the same wafer by totalizing them.;COPYRIGHT: (C)1999,JPO