首页> 外国专利> CITY WATER APPLIANCE FORMED OF COPPER ALLOY CONTAINING LEAD WHERE ELUSION OF LEAD IS REDUCED

CITY WATER APPLIANCE FORMED OF COPPER ALLOY CONTAINING LEAD WHERE ELUSION OF LEAD IS REDUCED

机译:减少含铅的铜合金制成的含铅铜合金的城市用水量

摘要

PROBLEM TO BE SOLVED: To surely prevent the elusion of lead from a surface of a water flow passage of a city water appliance formed of copper alloy containing lead such as brass and bronze by plating the water flow passage of the city water appliance formed of copper alloy containing lead. ;SOLUTION: A faucet metal is generally formed through casting or forging a copper alloy 1 such as bronze, and a lead 2 is added in the copper alloy 1 to improve the cuttability of the copper alloy 1 during the cutting in the manufacturing process. To prevent the lead from being eluded from a surface of a water flow passage of a city water appliance such as the faucet metal formed of copper alloy containing lead, the city water appliance is plated after pre-treatment for plating. In the plating method, non-electrolytic plating or electroplating can be used, including nickel plating, copper plating, tin plating, tin alloy plating and zinc plating.;COPYRIGHT: (C)1999,JPO
机译:要解决的问题:通过对由铜制成的城市用水设备的水流通道进行电镀,以确保防止铅从包含铅和铜的铜合金形成的城市用水设备的水流通道的表面渗出铅,例如黄铜和青铜。含铅合金。 ;解决方案:通常通过铸造或锻造诸如青铜之类的铜合金1来形成龙头金属,并在铜合金1中添加铅2以提高制造过程中切割过程中铜合金1的可切割性。为了防止铅从诸如含铅的铜合金形成的水龙头金属之类的自来水设备的水流通道的表面逸出,在对电镀进行预处理之后,对该自来水设备进行镀覆。在镀覆方法中,可以使用非电解镀覆或电镀,包括镍镀覆,铜镀覆,锡镀覆,锡合金镀覆和锌镀覆。;版权所有:(C)1999,JPO

著录项

  • 公开/公告号JPH11201337A

    专利类型

  • 公开/公告日1999-07-30

    原文格式PDF

  • 申请/专利权人 TOTO LTD;

    申请/专利号JP19980001868

  • 申请日1998-01-07

  • 分类号F16L9/02;F16L58/04;

  • 国家 JP

  • 入库时间 2022-08-22 02:36:43

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