MANUFACTURE OF TRANSFER MASTER, THE TRANSFER MASTER AND MANUFACTURE OF WIRING BOARD USING THE TRANSFER MASTER

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing multilayer wiring board which by forming multilayer wirings through the use of a plurality of transfer masters on which wiring portions are formed, sequentially pressing the individual transfer masters on one side of a base board for a multilayer wiring board and sequentially transferring the wiring portions on the base board and forms a wiring pattern layer with a highly uniform thickness, a transfer master and a method of manufacturing this master. ;SOLUTION: A method of manufacturing multilayer wiring board comprises (a) a step of forming a thin conductive layer 20 on one side a support 110, (b) a step of providing an insulating resin layer 31 formed in a predetermined shape on the thin conductive layer 20, and (c) a step of etching the thin conductive layer 20 using the insulating resin layer 31 of a predetermined shape as the mask, thereby forming a wiring portion comprising the conductive layer 20 in the shape of the insulating resin layer 31.;COPYRIGHT: (C)1999,JPO