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POLYAMIC ACID SOLUTION, POLYIMIDE FILM, AND METHOD FOR CONTROLLING PROPERTIES OF POLYIMIDE FILM

机译:聚酰胺酸溶液,聚酰亚胺薄膜以及控制聚酰亚胺薄膜性能的方法

摘要

PROBLEM TO BE SOLVED: To obtain a polyamic acid soln. which is useful for producing a polyimide film of which the refractive index or thermal expansion coefficient can be controlled without detriment to the light transmittance and which exhibits a remarkably decreased birefringence by using a polyamic acid and fine silicon dioxide particles having specified particle sizes as the main ingredients and by adjusting the content of the particles. ;SOLUTION: Fine silicone dioxide particles having particle sizes of 0.5-50 nm, pref. 5-50 nm, and a polyamic acid, pref. a fluorinated polyamic acid [e.g. one prepd. by reacting 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride with 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl], are used as the main ingredients. The amt. of the silicone dioxide particles incorporated into a polyimide film is required to be 50 wt.% or lower in terms of mechanical strengths and to be 1 wt.% or higher in terms of controlling the properties.;COPYRIGHT: (C)1999,JPO
机译:要解决的问题:获得聚酰胺酸溶液。通过使用聚酰胺酸和具有特定粒径的细二氧化硅颗粒,可用于生产折射率或热膨胀系数不受损害的可控折射率的聚酰亚胺薄膜,并且双折射显着降低。成分和通过调整颗粒的含量。 ;解决方案:细小二氧化硅颗粒,粒度为0.5-50 nm(优选)。 5-50nm,和聚酰胺酸,优选。氟化聚酰胺酸[例如一个准备。通过使2,2-双(3,4-二羧苯基)六氟丙烷二酐与2,2′-双(三氟甲基)-4,4′-二氨基联苯反应],作为主要成分。 AMT。就机械强度而言,掺入聚酰亚胺膜中的二氧化硅颗粒的含量要求为50wt。%或更低,就控制性能而言,要求为1wt。%或更高。COPYRIGHT:(C)1999,JPO

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