GLASS FIBER POWDER AND HIGH WATER RESISTANT RESIN MOLDING USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide glass fiber powder for a printed wiring board having combined characteristics of low permittivity and dielectric loss tangent and also superior water resistance, and its resin molding. ;SOLUTION: The glass fiber powder having a composition of (by wt.%) 50-60% SiO₂, 10-20% Al₂O₃, 20-30% B₂O₃, 0-5% CaO, 0-4% MgO, 0-0.5% LiO₂+ Na₂O+K₂O, 0.5-5% TiO₂, is treated the surface with an alkaline silane coupling agent. The resin containing the glass the fiber powder is molded to obtain the resin molding.;COPYRIGHT: (C)1999,JPO