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SUBSTRATE FOR ELECTRONIC MATERIAL EXCELLENT IN INSULATING PROPERTY AND ITS PRODUCTION

机译:电子材料在绝缘性能及其生产中的优良表现

摘要

PROBLEM TO BE SOLVED: To provide a flexible substrate for an electronic material to be hardly broken, capable of making it lighter than a glass substrate and excellent in insulating property and the production method. ;SOLUTION: In a substrate for an electronic material consisting of a base and a surface insulating layer, the surface insulating layer is formed by ≥1 kind of metal oxide and a nonconductive material other than the oxide. Al oxide, Ti oxide, Zr oxide, Mg oxide, Si oxide, Sn oxide, etc., are exemplified as the metal oxide and the Al oxide is preferably used among them. The oxide, nitride, hydroxide or oxyhydroxide of ≥1 kind of an element selected from a group consisting of Al, Si, Ti, Zr, Li, Mg, Sn and Zn are exemplified as the nonconductive oxide and in this case, a soln. in which a compd. having an Si-O bond is dissolved, is applied to the surface of an anodically oxidized film 2 and baked to form a surface insulating layer contg. the Si oxide.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:提供一种用于电子材料的几乎不破裂的挠性基板,该挠性基板能够比玻璃基板轻并且绝缘性和制造方法优异。 ;解决方案:在由基底和表面绝缘层组成的电子材料基板中,表面绝缘层由≥1种金属氧化物和除该氧化物以外的非导电材料形成。作为金属氧化物,可列举出例如氧化铝,氧化钛,氧化锆,氧化镁,氧化硅,氧化锡等,其中,优选使用氧化铝。选自Al,Si,Ti,Zr,Li,Mg,Sn和Zn的≥1种元素的氧化物,氮化物,氢氧化物或羟基氧化物作为非导电性氧化物,在这种情况下为sol。在其中。溶解具有Si-O键的Si,将其涂覆到阳极氧化膜2的表面上并烘烤以形成连续的表面绝缘层。氧化硅;版权:(C)1999,JPO

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