首页> 外国专利> PRODUCTION OF VINYL GROUP-CONTAINING ALICYCLIC ACRYLATE-BASED COMPOUND AND EPOXY GROUP-CONTAINING ALICYCLIC ACRYLATE-BASED COMPOUND

PRODUCTION OF VINYL GROUP-CONTAINING ALICYCLIC ACRYLATE-BASED COMPOUND AND EPOXY GROUP-CONTAINING ALICYCLIC ACRYLATE-BASED COMPOUND

机译:含乙烯基基团的丙烯酸丙烯酸酯类化合物和含环氧树脂基团的丙烯酸丙烯酸酯类化合物的生产

摘要

PROBLEM TO BE SOLVED: To provide a method for producing the subject vinyl-containing compound capable of providing the subject epoxy compound useful as an adhesive or the like, and having an alicyclic skeleton and a (meth)acryloyloxy by reacting a specific vinyl group-containing alicyclic epoxy compound by a specified method. ;SOLUTION: A vinyl group-containing alicyclic epoxy compound of formula I (R1, R2, R7 to R10, and R13 to R16 are each H, phenyl or a l-8C alkyl, with the proviso that any one of the R13 to R16 is vinyl or l methylvinyl) is reacted with an acrylic acid compound of the formula, CH2=CR11COOH (R11 is H, methyl or ethyl) in an molar ratio of the former to the latter regulated so as to be 1-1.6 to provide the objective compound of formula II [(n) is 1-10] in the method for producing the objective vinyl-containing compound. The compound of formula I is preferably vinylcyclohexene monoepoxide or the like. The reaction temperature is preferably 70-120°C. The epoxy group-containing alicyclic acrylate-based compound is obtained by epoxidizing the compound of formula II. An epoxidizing agent is preferably peracetic acid.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:提供一种制备目标含乙烯基化合物的方法,该方法能够通过使特定的乙烯基与-乙烯基化合物反应而提供可以用作粘合剂等的目标环氧化合物并且具有脂环式骨架和(甲基)丙烯酰氧基。通过指定方法含有脂环族环氧化合物。 ;解决方案:式I的含乙烯基的脂环族环氧化合物(R 1 ,R 2 ,R 7 至R 10 和R 13 至R 16 分别为H,苯基或1-8C烷基,条件是R 13中的任何一个到R 16 是乙烯基或1个甲基乙烯基)与式CH 2(Sup> 2 = CR 11 的丙烯酸化合物反应调节COOH(R ​​ 11 为H,甲基或乙基),将前者与后者的摩尔比调节为1-1.6,以提供目标式II的目标化合物[(n)为1 -10]在目标含乙烯基化合物的制备方法中。式I化合物优选是乙烯基环己烯单环氧化物或类似物。反应温度优选为70-120℃。含环氧基的脂环式丙烯酸酯类化合物是通过环氧化式II的化合物而获得的。环氧化剂优选为过乙酸。; COPYRIGHT:(C)1999,JPO

著录项

  • 公开/公告号JPH11209326A

    专利类型

  • 公开/公告日1999-08-03

    原文格式PDF

  • 申请/专利权人 DAICEL CHEM IND LTD;

    申请/专利号JP19980020486

  • 发明设计人 TAKAI HIDEYUKI;

    申请日1998-01-16

  • 分类号C07C69/54;C07C67/26;C07D303/16;C08F20/32;

  • 国家 JP

  • 入库时间 2022-08-22 02:35:31

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