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Aging hardenability special copper alloy

机译:时效淬透性特殊铜合金

摘要

PURPOSE: To provide a copper alloy for electronic parts improved in mechanical properties. ;CONSTITUTION: The copper alloy can be obtained by incorporating, by weight, 0.1-5% nickel, 0.01-7% silicon, 0.01-10% iron, 0.01-7% titanium, and 0.001-1% boron into copper as a principal component. As compared with the conventional alloy, this age hardening special copper alloy is improved in electric conductivity, thermal conductivity, and mechanical properties, particularly hardness and elasticity.;COPYRIGHT: (C)1993,JPO&Japio
机译:目的:提供一种机械性能得到改善的用于电子零件的铜合金。 ;组成:铜合金可通过将0.1-5%的镍,0.01-7%的硅,0.01-10%的铁,0.01-7%的钛和0.001-1%的硼按重量计掺入铜中而获得零件。与常规合金相比,这种时效硬化特殊铜合金在导电性,导热性和机械性能(尤其是硬度和弹性)方面得到了改善。; COPYRIGHT:(C)1993,JPO&Japio

著录项

  • 公开/公告号JP2904372B2

    专利类型

  • 公开/公告日1999-06-14

    原文格式PDF

  • 申请/专利权人 MIKAWA TSUNEAKI;OKUHARA MASAHIKO;

    申请/专利号JP19910287279

  • 发明设计人 MIKAWA TSUNEAKI;

    申请日1991-10-08

  • 分类号C22C9/06;

  • 国家 JP

  • 入库时间 2022-08-22 02:32:00

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