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Production manner null of the temperature measurement device and the temperature measurement device which use the joint structure and that joint structure

机译:使用该关节结构的温度测量装置和温度测量装置的制造方式及该关节结构

摘要

PURPOSE: To prevent a short circuit phenomenon and the exposure of a lead wire from a resin surface with simple work, by integrally making resin forming with a first resin connecting member so that a second resin connecting member is interposed between the lead wire connecting parts of the one lead and the other lead. ;CONSTITUTION: Resin forming is made integrally with a first resin connecting member 3, including an end of a sheath tube 5 and an end of a covering wire 11, so as to have a through gap 13 between respective lead connecting parts 12, 12 formed by welding a temperature measuring lead 6 of a temperature measuring means 1 and a lead 10 of an extension cable 2. The resin forming is further made integrally with a second resin connecting member 4, so as to be filled up also in the gap 13, on the first resin connecting member 3. An about uniform resin layer is formed in the outer circumference part of the first resin connecting member 3 by the second resin connecting member 4, the appearance is put in order, the seal is kept, and also the work efficiency is improved.;COPYRIGHT: (C)1995,JPO
机译:用途:为了防止短路现象和导线从树脂表面暴露出来的简单工作,通过与第一树脂连接件整体形成树脂成形,以使第二树脂连接件插入树脂的导线连接部分之间一个线索,另一个线索。组成:树脂成型与第一树脂连接件3一体成型,包括护套管5的一端和包线11的一端,以便在形成的各个引线连接部12、12之间形成贯通间隙13通过焊接测温装置1的测温导线6和延长电缆2的导线10。进一步与第二树脂连接构件4一体地形成树脂,从而也填充在间隙13中。在第一树脂连接构件3上,通过第二树脂连接构件4在第一树脂连接构件3的外周部分上形成大致均匀的树脂层,使外观整齐,保持密封,并且,工作效率得到了提高。;版权所有:1995年,日本特许厅

著录项

  • 公开/公告号JP2921344B2

    专利类型

  • 公开/公告日1999-07-19

    原文格式PDF

  • 申请/专利权人 YAMARI SANGYO KK;

    申请/专利号JP19930178949

  • 发明设计人 KIMURA HIDEO;YONESHITA KAZUYA;

    申请日1993-07-20

  • 分类号G01K7/02;G01K7/00;H01R4/62;

  • 国家 JP

  • 入库时间 2022-08-22 02:31:55

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