liquid-cooled heat sink for cooling electronic parts.

摘要

A heat sink Liquid Cooled (100) COMPONENTS FOR COOLING thermogenic (112). The heat sink has an element base (102) OPENED channels (104, 106) formed in at least one of its surfaces (118). Open ends (107) of the channels (104, 106) have an extension (SU) LESS THAN AN EXTENSION (SL) A BOTTOM OF CHANNELS (104, 106). A fluid conduit (114, 116) has an outer extension (SL) GREATER THAN THE EXTENSION (SU) open ends (107) of the channels (104, 106) and a flattened surface (110) is substantially coplanar with SURFACE (118) BASE ELEMENT hEATSINK (102) having the channels (104, 106).