TIN BISMUTH SOLDER PASTE, AND METHOD USING PASTE TO FORM CONNECTION HAVING IMPROVED HIGH TEMPERATURE PROPERTIES

摘要

A solder paste (24 inFig. 1) of the type utilized informing a solder connection (32in Fig. 2) for a microelectronicpackage comprises a mixtureof compositionally distinct metalpowders. The paste comprisesa first metal powder formed oftin-bismuth solder alloy. Thepaste further comprises a secondmetal powder containing goldor silver. During reflow, thegold or silver alloys with thetin-bismuth solder to increasethe melting part and enhancemechanical properties of theproduct connection.