LOW PROFILE FAN BODY WITH HEAT TRANSFER CHARACTERISTICS

摘要

A low profile fan body (20E) for cooling an electronic component has a fan frame (22E) supporting a fan (28E), which is mounted on a fan base (24E) forming a heat sink or heat transfer body. The fan (28E) has a plurality of fan blades (30E) received within a plenum chamber (51E) defined within the heat sink (24E). Each fan blade (30E) defines a first axial edge (31E), a second axial edge (33E) on a substantially opposite side of the blade (30E) relative to the first axial edge (31E), and a radial edge (35E) extending between the first and second axial edges (31E, 33E). The heat sink (24E) defines a base portion (38E) for engaging an exposed surface of the electronic component, and a plurality of heat fins (45E, 49E) spaced relative to each other along the periphery of the heat sink (24E) and defining the plenum chamber (51E). A pressure differential surface (34E) is disposed between the radial edges (35E) of the fan blades (30E) and the fins (45E) for directing air flow in the axial direction of the fan (28E). The radial edges (35E) of a plurality of the fan blades (30E) are at least partially exposed to the adjacent heat fins (45E, 49E) defining a flow path for cooling air across the radial edges (35E) exposed to the heat fins (45E, 49E). The second axial edges (33E) of the fan blades (30E) are located adjacent to and spaced from the base portion (38E) of the heat sink (24E), defining an additional flow path for cooling air between the second axial edges (33E) and the base portion (38E).