Fault analysis method, recording media and process control method

摘要

Obtain a defect analysis method that can quantitatively determine the effect on the yield of defects in one process alone.;After the determination of the presence or absence of a new defect by a predetermined process and a defect test by an electric tester, a plurality of chips on the wafer are subjected to 1) no new defect and good quality, 2) no new defect and bad quality, and 3) new defect and good quality. ④ The chip is classified into four types of defective or defective products, and according to the classification result, the number of chips that are defective only by the new defects of a predetermined process, the number of new defective chips that are estimated, and the new defects of a predetermined process are defective. The ratio, the estimated fatality rate, the number of chips made defective by the predetermined process and the estimated number of process defective chips are obtained.