METHOD AND APPARATUS FOR COOLING MULTI-CHIP MODULE USING INTEGRALEATPIPE TECHNOLOGY

摘要

A method and apparatus for cooling a multichip module with integrated heatpipes is disclosed. A multichip semiconductor chip is embedded in a mounting substrate with electrical connection elements (elements) disposed on one side thereof, while the heat sink is integrated into the substrate on the other side while contacting the semiconductor chip at its bottom surface. The heatpipes are mounted directly to the heat sink. Within the heat pipe there is a chamber for receiving the refrigerant and the wick. Heat enters from the semiconductor past the heat sink and finally into the heat pipe, where the region immediately adjacent to the heat sink is heated to evaporate the refrigerant. The evaporated refrigerant then moves to the opposite side of the heatpipe, where it cools, condenses and becomes liquid again. The wick sucks the condensate back into the evaporation section by capillary action. In a preferred embodiment, when mounting the multichip module on the mother board, the module is flipped over such that the semiconductor chip and its electrical connection elements are directly connected to the mother board so that the heatpipes are located on top. In this inverted layout, heat rises naturally past the heat sink and the heat pipe and also into the outside environment.