Mr. D. Rom. Drive thermal dissipation device

摘要

Discloses a thermal dissipation device for a D-ROM drive.;This is accomplished by forming a printed circuit board, one or more integrated circuits attached to the backside of the printed circuit board and emitting high temperature, and a recessed portion only at the locations where the integrated circuits are located to dissipate the high temperatures emitted by the integrated circuits This includes the bottom surface of the CD drive, which is configured to contact the printed circuit board at a finely spaced distance.;Therefore, it is possible to reduce the production cost by forming only the bottom surface concave and radiating heat without using the heat radiating plate and the heat radiating pad.