The present invention relates to a power IC fixed structure of a car audio, the main chassis (2) in the structure of assembling the upper body of the power IC 12 to the elastic piece 6 formed in the car audio main chassis (2) The cut holes 8 are formed upward from the upper end of the elastic piece 6, and the cut holes 8 are formed in the elastic pieces 6 of the main chassis 2 to which the power IC 12 is assembled. The gap between the elastic piece 6 and the power IC 12 is reduced by reducing the contact area between the power IC 12 and the elastic piece 6 and reducing the elastic force to spread outward of the elastic piece 6. The heat absorbing surface 22 of the power IC 12 and the heat dissipation plate 20 may be formed so that a gap is not formed between the heat dissipation plate 20 and the power IC 12 assembled to the rear surface of the power IC 12. ) Is completely in contact with each other so that the heat generated from the power IC 12 That will increase the thermal efficiency of the chamber heat sink 20 by making pass smoothly into the heat absorbing surface 22 of the heat sink.
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