Power semiconductor module with closed submodules

摘要

The module has each of several sub-modules (1) containing a semiconductor (5a,b) with all sub-modules secured on a common, heat convecting bottom plate (4) and contacted by conductors (12,14,18) connectable from outside. At least one semiconductor chip of a sub-module is encapsulated in a casing. The encapsulation comprises outside electrodes for power contacts of the chip. The securing and contacting of each encapsulated sub-module on the power semiconductor module (10) are easily separable. The encapsulation contains a cast of electrically insulating mass and the outside electrodes are flat. Through the cast is brought out a gate terminal (9) for each gate contact.