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LCD screen TFT matrix is produced using only three lacquering steps

机译:LCD屏幕TFT矩阵仅需三个上漆步骤即可生产

摘要

A thin film transistor (TFT) matrix is produced using only 3 lacquering steps by combining several process steps by double exposure of photolacquer layers and by using a lift-off technique for combined removal of photolacquer and passivation in the region of the contacts. A TFT matrix for liquid crystal display screens is produced by (a) applying a transparent conductive layer (11) for the pixel electrodes on a substrate (10); (b) applying a metal (12) for the rows and as gate contacts for the TFTs; (c) coating with photolacquer (13) which is then subjected to a first exposure, followed by structuring the gate contacts and pixel electrodes, and a second exposure, followed by removing the metal layer (12) in the region of the pixels (BP); (d) removing the photolacquer layer (13); (e) successively applying a gate insulation, a semiconductor especially of a:Si-H and a p- or n-doped semiconductor as source/drain contacts; (f) applying a metallization to the matrix gaps and the source/drain contacts; (g) coating with photolacquer (13) which is then subjected to a first exposure, followed by structuring the metallization outside the semiconductor channels of the TFTs, and a second exposure, followed by structuring the doped and intrinsic semiconductor layers outside the semiconductor channels of the TFTs; (h) removing the metallization and then the doped semiconductor in the channel regions; (i) removing the photolacquer (13) and applying a further contact metallization which is structured after coating with photolacquer; (j) applying a transparent passivation; and (k) removing the passivation in the region of the contacts by removing the photolacquer (13).
机译:薄膜晶体管(TFT)矩阵仅通过3个上漆步骤即可生产,方法是通过多次曝光光漆层并结合剥离技术,在触点区域内联合去除光漆和钝化工艺,将多个工艺步骤组合在一起。通过(a)在基板(10)上施加用于像素电极的透明导电层(11),来制造用于液晶显示屏的TFT矩阵。 (b)在行上施加金属(12),并作为TFT的栅极触点; (c)用光致抗蚀剂(13)涂覆,然后对其进行第一次曝光,然后构造栅极触点和像素电极,并进行第二次曝光,然后去除像素(BP)区域中的金属层(12) ); (d)去除光致抗蚀剂层(13); (e)依次施加栅绝缘,特别是a:Si-H的半导体和p或n掺杂的半导体作为源极/漏极触点; (f)对基体间隙和源极/漏极触点进行金属化处理; (g)用光致抗蚀剂(13)涂覆,然后对其进行第一次曝光,然后在TFT的半导体通道外部构造金属化层,并进行第二次曝光,然后在TFT的半导体通道外部构造掺杂和本征半导体层。 TFT; (h)去除沟道区中的金属,然后去除掺杂的半导体; (i)除去光致抗蚀剂(13)并施加在光致抗蚀剂涂布后结构化的另一接触金属化层; (j)应用透明钝化; (k)通过去除光漆(13)来去除接触区域中的钝化。

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