Sensor arrangement for measuring pressure, force or measured values, which are supported on pressure or force can be attributed, process for the preparation of the sensor arrangement, the sensor element and the process for the production of the sensor element

摘要

The present invention relates to a sensor arrangement for measuring pressure, force or measured values, which are supported on pressure or force can be attributed, a method for producing such a sensor arrangement as well as a sensor element and a method for producing a sensor element. Dollars a the sensor arrangement according to the invention comprises a chip (1) on si - base with sensory transducer areas and a first front - and a first rear side, on at least the first rear side of the opening a structured surface with a thin areas (3), wherein the structured surface on the first rear side of a more intensive low polish as the first front side, and a carrier substrate (2) with a second front - and a second rear side, wherein the second front side is smooth and is largely free of gaps and the chip and the carrier substrate are joined together in such a way that the first and second rear side adjoin one another. Dollars a by the present invention, therefore, a largely flat sensor arrangement with as little as possible of the joints or depressions provided. Dollars a further advantages of the present invention relate to the possibility of an efficient and cost-effective manufacture of the sensor arrangement by means of a full - wafer - joining technique, as well as the possibility, with the sensor arrangement according to the invention to measure very high pressures. Dollars a the device according to the invention can advantageously be used in the foods industry as if, for ..