Non-aqueous solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers (III)

摘要

The invention herein is curable adhesive and sealant compositions and a non-aqueous solvent free process for producing such compositions which comprise a mono-ol, tackifying resin, and a monohydroxylated epoxidized polydiene polymer which is comprised of at least two polymerizable ethylenically unsaturated hydrocarbon monomers wherein at least one is a diene monomer which yields unsaturation suitable for epoxidation and wherein the polymer contains from 0.1 to 7.0 milliequivalents of epoxy per gram of polymer. The process involves mixing the components together with a photoinitiator which is selected from the group consisting of diaryl, especially diaryliodonium, salts characterized by the general formula: ##STR1## where Y is ##STR2## where R is hydrogen, aryl, alkyl, or an alkylhalide; n is an integer of at least 1, Z is I, Cl, or Br, preferably I, and X is a complex metal halide anion or a complex halide anion of a strong protonic acid.